Product List

This is a copper-free metal bond wheel with spindle that limits the use of copper and steel in the bond.
The "copper free" wheel uses a unique bond formulation to achieve mechanical properties comparable to those of bronze-based bonds without the use of copper.
In machining tests, it has a grindability and lifespan comparable to that of bronze-based bonds.
The use of copper-free wheels prevents copper contamination of workpieces when machining jigs used in the preprocessing of semiconductors, which are particularly sensitive to copper contamination, and reduces the need for cleaning and removal processes in subsequent processes.

This wheel is designed for surface grinding of electronic or semiconductor materials such as ceramics, quartz, and sapphires. The ""G2(G square)"" porous vitrified bond ensures high cutting performance and efficient, precision grinding can be achieved
if the wheel is combined with special segment shapes.

The "MF50" metal bond wheel is used for fine ceramics forming, glass substrate chamfering, and the forming of other hard brittle materials. Its advantages include high cutting performance and low grinding noise.

This wheels is used for forming / grooving of fine ceramics, quartz and other hard brittle materials and high-speed steel, and chamfering of glass substrates.

The "MB" bond series is a resin bond wheel with high shape retention using heat-resistant resin and metal filler. It has high sharpness and high shape retention in heavy-duty grinding with a large depth of cut.
The ability to form by electrical discharge machining makes it possible to form differently shaped abrasive grain layers, which are usually difficult to form, making this bond very suitable for machining with formed tools in plunge grinding.


The "MB" bond series is a bond that works well with both diamond and CBN wheels.
The diamond wheels are suitable for machining with formed tools for quartz, ceramics, and cemented carbides.
CBN wheels are suitable for the machining of high-speed steel blades and for machining with formed tools for iron-based machine parts that require high accuracy.
Since the wheels are heat resistant and capable of heavy-duty grinding, we have experience in machining with formed tools using multi-wheels that combine several wheels.

This wheel takes full advantage of aligned pellets for large-area surface grinding of materials such as quartz and ceramics in situations where flatness and cutting performance are required. Various pellet shapes and bonds are available to meet material features and wheel usage requirements.

"BL" porous resin bond wheels are designed for mirror grinding of cemented carbide / tungsten carbide molds, ceramics, silicon wafers, and hardening steel alloys. With the effect of pores and a heat-resistant bond strengthened by special filler, these wheels produce high quality finished surfaces while maintaining their cutting performance.

■ Single-piece formation of a resin bond wheel with a maximum outer diameter of φ600mm and width of T100mm can be realized.
■ Grinding trace at joint is eliminated.
■ Dynamic balance of 0.1μm is realized for products with a dedicated flange.

This chamfering wheel is designed to maintain substrate strength when fabricating glass display panels and cover glasses. Wheels for facilitating high-speed substrate feeding are available for various machines.

High-quality finishing is realized by electroplating fine abrasive grains of around #1000～#2000.
■ High-quality finishing is realized with good surface roughness and less tipping.
■ High ability of maintaining the wheel shape realizes high-precision shape forming.
■ Multi-layered electroplating can be conducted to extend the life of the wheel.

These wheels are used to chamfer the inner diameter (ID) or outer diameter (OD) edge of glass disks. Due to the special electroplating used in this design, the roughness of chamfered surfaces are improved and chipping at the boundary area to the edge surface is minimized. Wheels using micron size abrasive grain are available.