Product List

These wheels are used for the internal grinding of precision parts and precision machining of glass, ceramics, carbon, ferrite, and precious stones. We provide wheels with the most suitable bond and specifications for the work material and application.

Metal bonds are ideal for machining hard and brittle materials. It is especially suitable for machining fine ceramics such as silicon carbide (SiC), aluminum nitride (AlN), silicon nitride (SiN), and quartz glass.

The electrodeposition bond has good sharpness and versatility, and can be used not only for hard and brittle materials but also for carbon, ferrite, MMC materials, FRP, and cemented carbide.

Resin bond is used for the purpose of reducing damage such as chipping of the workpiece and for finishing processes that require surface roughness.

It is also possible to manufacture wheels with spindles with an outer diameter of φ100 or larger by joining a straight wheel or cup wheel to the spindle. Please consult with us for such products.

This is a copper-free metal bond wheel with spindle that limits the use of copper and steel in the bond.
The "copper free" wheel uses a unique bond formulation to achieve mechanical properties comparable to those of bronze-based bonds without the use of copper.
In machining tests, it has a grindability and lifespan comparable to that of bronze-based bonds.
The use of copper-free wheels prevents copper contamination of workpieces when machining jigs used in the preprocessing of semiconductors, which are particularly sensitive to copper contamination, and reduces the need for cleaning and removal processes in subsequent processes.

This wheel is designed for surface grinding of electronic or semiconductor materials such as ceramics, quartz, and sapphires. The ""G2(G square)"" porous vitrified bond ensures high cutting performance and efficient, precision grinding can be achieved
if the wheel is combined with special segment shapes.

The "MF50" metal bond wheel is used for fine ceramics forming, glass substrate chamfering, and the forming of other hard brittle materials. Its advantages include high cutting performance and low grinding noise.

This wheels is used for forming / grooving of fine ceramics, quartz and other hard brittle materials and high-speed steel, and chamfering of glass substrates.

The "MB" bond series is a resin bond wheel with high shape retention using heat-resistant resin and metal filler. It has high sharpness and high shape retention in heavy-duty grinding with a large depth of cut.
The ability to form by electrical discharge machining makes it possible to form differently shaped abrasive grain layers, which are usually difficult to form, making this bond very suitable for machining with formed tools in plunge grinding.


The "MB" bond series is a bond that works well with both diamond and CBN wheels.
The diamond wheels are suitable for machining with formed tools for quartz, ceramics, and cemented carbides.
CBN wheels are suitable for the machining of high-speed steel blades and for machining with formed tools for iron-based machine parts that require high accuracy.
Since the wheels are heat resistant and capable of heavy-duty grinding, we have experience in machining with formed tools using multi-wheels that combine several wheels.

This wheel takes full advantage of aligned pellets for large-area surface grinding of materials such as quartz and ceramics in situations where flatness and cutting performance are required. Various pellet shapes and bonds are available to meet material features and wheel usage requirements.

"BL" porous resin bond wheels are designed for mirror grinding of cemented carbide / tungsten carbide molds, ceramics, silicon wafers, and hardening steel alloys. With the effect of pores and a heat-resistant bond strengthened by special filler, these wheels produce high quality finished surfaces while maintaining their cutting performance.

■ Single-piece formation of a resin bond wheel with a maximum outer diameter of φ600mm and width of T100mm can be realized.
■ Grinding trace at joint is eliminated.
■ Dynamic balance of 0.1μm is realized for products with a dedicated flange.

Precision blade for cutting package boards.
We offer a rim saw type blade with a metal base (base metal) and an all-blade type.
Metal bond blade with good sharpness and cutting quality.
Stable sharpness without deterioration due to copper adhesion prevents cracking and chipping of package boards.

Depending on the blade thickness and particle size, the V-face shape of the cutting edge has the effect of suppressing the occurrence of initial chipping of the board.
We can also offer a dress board for dressing blades and propose the most appropriate dress board for the blade specifications.
It is widely used for machining of not only package boards, but also laminated ceramics, magnetic materials, and optical glasses.

This single-crystal diamond drill is used for drilling 1 mm or smaller holes in hard brittle materials such as silicone and ceramics. Compared to PCD drills and coating drills it causes less damage to the interior wall of the drilled holes and can significantly reduce hairline cracks and surface roughness, which are usually problems when working with hard brittle materials, thus, providing stable cutting performance.