Product List

This is a small-diameter drill using PCD/polycrystalline diamond for the cutting edge, and is suitable for continuous hole drilling in silicon. The spiral grooves provide good chip evacuation and reduce the frequency of step machining.

Higher surface roughness realized by intermediate processing and final processing of SiC and GaN wafers
■Higher surface roughness is realized by the combination of ultra-fine diamond abrasive grains and vitrified bonds of large and fine porous combination structure.
■Spontaneous blade generation is realized and cutting quality is maintained by bonds that can make ultrafine shredding.
■Stable high-quality surface and low processing cost can be realized.

High grinding performance and long tool life for processing of sapphire or SiC wafers
■The porous structure of metal bonds improves biting for higher grinding performance and enhances heat dissipation for longer tool life.
■Not only abrasion resistance of highly rigid metal bonds but also maintaining of cutting quality by appropriate spontaneous blade generation are realized.
■Longer tool life contributes to the stabilization of processing quality and reduction of processing cost.

These metal bond wheels are designed with a new concept, and have both the high cutting performance of resin bonds and the abrasion resistance of metal bonds. They are suitable for efficient grinding of difficult-to-cut materials such as Al2O3-TiC and quartz.

This wheel is used for edge grinding (beveling) semiconductor wafers.
We offer "ME" bond for wheels for chamfering silicon wafers with excellent sharpness and high maintenance of groove shape. The finished surface roughness is excellent, and the amount of polishing after chamfering is reduced, leading to lower total processing costs by reducing the post-process time and consumables.

For wheels for chamfering SiC and sapphire wafers, we offer bond wheels with excellent sharpness and grinding durability. Electrodeposition bond chamfering wheels are also available for small and medium volume production.

For wheels for chamfering LT and LN wafers, we offer bond specifications that suppress the occurrence of chipping on brittle wafers.

In addition to general R-shaped (round/full round) and T-shaped grooves, special shapes such as asymmetrical shapes are also covered, so please consult with us.
 

[Applicable materials for diamond beveling wheels]

Silicon, SiC (silicon carbide), Sapphire, LT (lithium tantalate), LN (lithium niobate), GaN (gallium nitride), GaAs (gallium arsenide), and Quartz

This wheel is used for chamfering and finishing the notch of semiconductor wafers. The runout accuracy of the diamond layer to the shank is excellent due to our original processing technology. In addition to silicon wafers, we also provide wheels with various specifications for compound semiconductor wafers such as SiC (silicon carbide) and LT (lithium tantalate), which are becoming larger nowadays, and for quartz wafers.
 

[Applicable materials for diamond notch wheels]

Silicon, SiC (silicon carbide), LT (lithium tantalate), LN (lithium niobate), Quartz, and Sapphire

A single wheel of this type can perform multiple grinding processes such as rough grinding, pre-finishing, and finishing. This allows multiple processes to be performed with a single machine without replacing tools, which reduces processing time. Multi-layer wheels with a combination of metal bonds for rough grinding, resin bonds for pre-finishing, and resin bonds for finishing are available.

This wheel is used for dressing/conditioning the polishing pads used in the flattening process of semiconductor devices.
Electroplated the appropriate abrasive grains of the selected diamond to a base metal brings stable dressing/conditioning, and results in reduced individual differences.

Work materials: Urethan pad, Non-woven fabric pad, Suede pad, which are semiconductor polishing pad

Diamond core drills were originally designed for drilling and coring of hard and brittle materials, but their use is now expanding to include the shape machining of hard materials such as ceramics on machining and gliding centers.
The coolant is supplied with a center-through structure, which allows chips to escape easily and reduces damage to the tool and workpiece caused by the chips, thus enabling highly efficient machining.
This tool is ideal for spot facing by helical grinding in narrow widths where chips tend to accumulate.
We offer the most suitable shape for high-efficiency drilling of ceramics.
The strong bond bridge structure ensures long life and stable cutting performance.

Diamond metal bond wheels with spindle are specially designed for machining hard and brittle materials.
We offer the most suitable bond specifications for various materials in the grinding process of hard and brittle materials using a machining/gliding center.
The metal bond wheel has high abrasive grain retention and high sharpness even when machining hard materials. It also has good thermal conductivity, which prevents heat buildup at the machining point and prevents thermal cracking of brittle materials. The tool life is longer than that of electrodeposition tools with a single diamond layer, and it is the best tool for machining ceramics, especially hard SiC and aluminum nitride.
In the machining of quartz glass, the optimum bond selection ensures high grinding durability.