Product List

"BL" porous resin bond wheels are designed for mirror grinding of cemented carbide / tungsten carbide molds, ceramics, silicon wafers, and hardening steel alloys. With the effect of pores and a heat-resistant bond strengthened by special filler, these wheels produce high quality finished surfaces while maintaining their cutting performance.

■ Single-piece formation of a resin bond wheel with a maximum outer diameter of φ600mm and width of T100mm can be realized.
■ Grinding trace at joint is eliminated.
■ Dynamic balance of 0.1μm is realized for products with a dedicated flange.

This single-crystal diamond drill is used for drilling 1 mm or smaller holes in hard brittle materials such as silicone and ceramics. Compared to PCD drills and coating drills it causes less damage to the interior wall of the drilled holes and can significantly reduce hairline cracks and surface roughness, which are usually problems when working with hard brittle materials, thus, providing stable cutting performance.

These products are used for lapping and polishing high-hardness materials such as glass, ceramics, ferrites, sapphires, and cemented carbide / tungsten carbide when high-precision surface finishing is required. Highly precise diamond powder is used for slurry products.