"Copper-free" metal bond wheel with spindle for semiconductor manufacturing equipment components

This is a copper-free metal bond wheel with spindle that limits the use of copper and steel in the bond.
The "copper free" wheel uses a unique bond formulation to achieve mechanical properties comparable to those of bronze-based bonds without the use of copper.
In machining tests, it has a grindability and lifespan comparable to that of bronze-based bonds.
The use of copper-free wheels prevents copper contamination of workpieces when machining jigs used in the preprocessing of semiconductors, which are particularly sensitive to copper contamination, and reduces the need for cleaning and removal processes in subsequent processes.