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Multi-grooving with formed tools for quartz and ceramics
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Longer wheel life in "rough machining" prior to surface grinding of SiC wafers
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Longer life of edge grinding (beveling) wheels for compound semiconductor wafers
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Longer life of beveling wheels for sapphire wafers
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Longer life of finishing notch wheels for silicon wafers
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Stable grinding performance in spot facing of highly brittle materials such as aluminum nitride
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Realization of efficient machining of difficult-to-cut materials with the help of ultrasonic waves
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Realization of highly efficient machining of difficult-to-cut materials such as alumina and Si3N4
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Extend wheel life by reducing chipping in chamfering of curved cover glass
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Improved edge strength in cover glass chamfering for smartphones and other information terminals
