Improved edge strength in cover glass chamfering for smartphones and other information terminals
[Issues in chamfering cover glass]
Cover glass for smartphones and other devices, which are becoming thinner and lighter, needs to be chamfered to suppress micro-cracks and increase edge strength.[Solution with metal bond wheel]
In the chamfering process of cover glass, switching from inexpensive electroplated wheels widely used today to our metal bond wheels, can improve the edge strength by suppressing micro-cracks.
The chamfering by the metal bond wheel provides excellent roughness of the machined surface and nearly three times the end-face strength compared to chamfering by the electroplated wheel. In addition, the metal bond chamfering wheel realizes high-precision form grinding, improves machining efficiency, and has a long service life with sustained cutting performance.
Comparison of workpiece edge strength after chamfering by electroplated and metal bond wheel (average of 4-point bending strength)
Test Conditions for Comparison of Edge Strength
Pressing speed : 8mm/min
Grain size of the electroplated wheel : #800
Grain size of the metal bond wheel : #600
Optimal grinding tools for efficient chamfering
Metal bond mounted wheel for chamfering glass
[Example of product specifications]
Bond : “ME” or “123C” metal bond
Grain size : #800 or #600 (for rough grinding)
A high-precision formed wheel is necessary for efficient chamfering. Using our original machining technology, we are able to manufacture formed metal bond wheels that can realize high-precision forming of shapes.
In addition, metal bond wheels are self-sharpening and have a durable cutting ability and long life.
